Basic Soldering For Electronics Pace Handbook Of North
Glenn Blackwell
- Basic Soldering For Electronics Pace Handbook Of North American
- Basic Soldering For Electronics Pace Handbook Of North Asia
- Basic Soldering For Electronics Pace Handbook Of North Carolina
- Basic Soldering For Electronics Pace Handbook Of North Dakota
- Basic Soldering For Electronics Pace Handbook Of North American
- Basic Soldering For Electronics Pace Handbook Of North Usa
- Basic Soldering For Electronics Pace Handbook Of North Carolina
KELA 0172 IPC-A-610F Acceptability of Electronic Assemblies IPC 1-580986-28-5 KELA 0151 Pace High Reliability Interconnection Technology Handbook PACE 5050-0082 Pace Workbook Basic Soldering for Electronics PACE 5050-0083 KET2 0109 Introductory Mathematics, 4th Edition Cook; Prentice Hall 849. 7.1.1 Soldering Basics R, F, W, C N/A I C 7.1.2 Preparation For Soldering And Component Removal R, F, W, C N/A I C 7.1.3 Solder Joint Acceptance Criteria R, F, W, C N/A I C 7.2.1 Soldering Through Hole Components, Point To Point Method R, F, W, C High I C 7.2.2 Soldering Through Hole Components, Solder Fountain Method R, F, W, C High E C.
Purdue University
Electrical & Computer Engineering Technology Dept.
UTEC SMT Course 2014 Web Page
The Universidad De Ingenieria & Technologia (UTEC) in Lima, Peru, is a new engineering university in South America. Their web site is www.utec.edu.pe.Electronics is an important part of their curriculum, so together we have developed a short course on Surface Mount Technology (SMT) to introduce their students to three aspects of the use of SMT:
vBasics of SMT components and assembly processes
vPCB design using SMT components, including high-current and high-speed circuits
vBasic hand assembly, assisted hand assembly, and rework/repair of SMT-based assemblies.
The text for the course is Blackwell & Hollomon, Surface-Mount Technology for PC Boards, 2nd edition, Thompson/Delmar Learning, 2006.
Basic Soldering For Electronics Pace Handbook Of North American
Here is the errata sheet for the text: B&H Errata
The reason for the course is the continuing increase in the impact of electronics in many areas of technology. An example of electronics’ impact on the automotive industry is here: Automotive Electronics
Here is a basic introduction to surface mount technology, courtesy of Radio-Electronics magazine: R-E SMT Introduction
Cross-section of an example PC board, which shows how SMT components allow easier routing, and in many cases fewer layers, than through-hole technology (THT) components.
THT component leads require that every layer be clear of the hole, while SMT components only affect routing on the surface layer to which they will be soldered.
The course will consist of morning and afternoon lectures, and morning and afternoon laboratories.
Basic Soldering For Electronics Pace Handbook Of North Asia
```
`SMT decoupling caps on the bottom of a BGA board.
References for the course, in addition to the textbook, include:
vIntel Packaging Handbook: http://www.intel.com/design/packtech/packbook.htm, chapter 1 “Component Surface Mount Technology”, and chapter 2 “SMT Board Assembly Recommendations”.
vTexas Instruments basic SMT component handling, process recommendations, and basic repair/rework recommendations: TI AN-2029
vSilicon Laboratories Application Note on hand soldering QFP packages: Hand Soldering Tutorial for Fine Pitch QFP Devices
vConceptronic Reflow Technology Handbook: Conceptronic RT Handbook
Basic Soldering For Electronics Pace Handbook Of North Carolina
`
LLP/QFN, one of the newer SMT packages discussed in the course.
The course reference for LLP/QFN packages is TI Application Note AN-1187, “Leadless Leadframe Package”: TI AN1187 LLP
And for QFN PCB design, TI “QFN Design Guide”: TI SLMA006 QFN
For any small SMT package, thermal transfer of heat to the board is important. This issue is discussed in TI AN-1520, “A Guide to Board Layout for Best Thermal Resistance for Exposed Packages”:TI AN-1520
Course References:
Thermal Issues, IC:
Texas Instruments “Understanding IC Package Power Capabilities”, http://www.ti.com/lit/an/snva509a/snva509a.pdf
Thermal Issues, PCB:
Ultracad Designs: http://www.ultracad.com/article_outline.htm
Saturn PCB Toolkit: http://www.saturnpcb.com/pcb_toolkit.htm
Blackwell & Hollomon,chapter 5 section 5.8
Texas Instruments application note AN-1520: http://www.ti.com/lit/an/snva183b/snva183b.pdf
High-Speed, By-pass Capacitors:
Ultracad Designs: http://www.ultracad.com/article_outline.htm
Blackwell & Hollomon, chapter 5, section 5-10
Xilinx Vertex-6 PCB Design Guide: http://www.xilinx.com/support/documentation/user_guides/ug203.pdf
Wizards in high-speed design:
Doug Brooks: http://www.ultracad.com
Eric Bogatin: http://bethesignal.com/bogatin
Howard Johnson: http://www.sigcon.com
Lee Ritchey: http://speedingedge.com
General SMT References
General SMT Information:
- SMT Net: www.smtnet.com
- SMT Magazine: www.smtmagazine.com
- Surface
- Intel Packaging Databook chapter 1, “Component Surface Mount Technology” and chapter 2, “SMT Board Assembly Recommendations”, available at www.intel.com/design/packtech/packbook.htm
- Circuit Technology’s newsletter and white papers: www.circuitnet.com
- High-speed and bypass capacitor information from UltraCAD Design, Inc., available at www.ultracad.com .
Solder paste information:
- Amtech Solder: www.amtechsolder.com
- Kester Solder: www.kester.com
Hand soldering and rework & repair:
- Metcal Corp: www.metcal.com
- Pace Corp.:www.paceworldwide.com
Circuit board design:
- PCB Design & Fabrication magazine: www.pcdandf.com
- PCB Standards for design, manufacturing, and testing, the IPC: www.ipc.org
Lead Free Solder and related Tin Whisker problems:
·IPC Leadfree Site
·NASA Tin Whisker Basics
·Intel Packaging Databook chapter 2, “Component Surface Mount Technology”, available at www.intel.com/design/packtech/packbook.htm
This page last updated 08 August, 2014
Glenn Blackwell
Purdue University
Electrical & Computer Engineering Technology Dept.
UTEC SMT Course 2014 Web Page
The Universidad De Ingenieria & Technologia (UTEC) in Lima, Peru, is a new engineering university in South America. Their web site is www.utec.edu.pe.Electronics is an important part of their curriculum, so together we have developed a short course on Surface Mount Technology (SMT) to introduce their students to three aspects of the use of SMT:
vBasics of SMT components and assembly processes
vPCB design using SMT components, including high-current and high-speed circuits
vBasic hand assembly, assisted hand assembly, and rework/repair of SMT-based assemblies.
The text for the course is Blackwell & Hollomon, Surface-Mount Technology for PC Boards, 2nd edition, Thompson/Delmar Learning, 2006.
Here is the errata sheet for the text: B&H Errata
The reason for the course is the continuing increase in the impact of electronics in many areas of technology. An example of electronics’ impact on the automotive industry is here: Automotive Electronics
Here is a basic introduction to surface mount technology, courtesy of Radio-Electronics magazine: R-E SMT Introduction
Cross-section of an example PC board, which shows how SMT components allow easier routing, and in many cases fewer layers, than through-hole technology (THT) components.
THT component leads require that every layer be clear of the hole, while SMT components only affect routing on the surface layer to which they will be soldered.
The course will consist of morning and afternoon lectures, and morning and afternoon laboratories.
```
`SMT decoupling caps on the bottom of a BGA board.
References for the course, in addition to the textbook, include:
vIntel Packaging Handbook: http://www.intel.com/design/packtech/packbook.htm, chapter 1 “Component Surface Mount Technology”, and chapter 2 “SMT Board Assembly Recommendations”.
vTexas Instruments basic SMT component handling, process recommendations, and basic repair/rework recommendations: TI AN-2029
vSilicon Laboratories Application Note on hand soldering QFP packages: Hand Soldering Tutorial for Fine Pitch QFP Devices
vConceptronic Reflow Technology Handbook: Conceptronic RT Handbook
`
LLP/QFN, one of the newer SMT packages discussed in the course.
The course reference for LLP/QFN packages is TI Application Note AN-1187, “Leadless Leadframe Package”: TI AN1187 LLP
And for QFN PCB design, TI “QFN Design Guide”: TI SLMA006 QFN
For any small SMT package, thermal transfer of heat to the board is important. This issue is discussed in TI AN-1520, “A Guide to Board Layout for Best Thermal Resistance for Exposed Packages”:TI AN-1520
Course References:
Thermal Issues, IC:
Basic Soldering For Electronics Pace Handbook Of North Dakota
Texas Instruments “Understanding IC Package Power Capabilities”, http://www.ti.com/lit/an/snva509a/snva509a.pdf
Thermal Issues, PCB:
Ultracad Designs: http://www.ultracad.com/article_outline.htm
Saturn PCB Toolkit: http://www.saturnpcb.com/pcb_toolkit.htm
Blackwell & Hollomon,chapter 5 section 5.8
Texas Instruments application note AN-1520: http://www.ti.com/lit/an/snva183b/snva183b.pdf
High-Speed, By-pass Capacitors:
Ultracad Designs: http://www.ultracad.com/article_outline.htm
Blackwell & Hollomon, chapter 5, section 5-10
Xilinx Vertex-6 PCB Design Guide: http://www.xilinx.com/support/documentation/user_guides/ug203.pdf
Wizards in high-speed design:
Doug Brooks: http://www.ultracad.com
Eric Bogatin: http://bethesignal.com/bogatin
Howard Johnson: http://www.sigcon.com
Lee Ritchey: http://speedingedge.com
General SMT References
General SMT Information:
- SMT Net: www.smtnet.com
- SMT Magazine: www.smtmagazine.com
- Surface
- Intel Packaging Databook chapter 1, “Component Surface Mount Technology” and chapter 2, “SMT Board Assembly Recommendations”, available at www.intel.com/design/packtech/packbook.htm
- Circuit Technology’s newsletter and white papers: www.circuitnet.com
- High-speed and bypass capacitor information from UltraCAD Design, Inc., available at www.ultracad.com .
Solder paste information:
- Amtech Solder: www.amtechsolder.com
- Kester Solder: www.kester.com
Hand soldering and rework & repair:
Basic Soldering For Electronics Pace Handbook Of North American
- Metcal Corp: www.metcal.com
- Pace Corp.:www.paceworldwide.com
Circuit board design:
- PCB Design & Fabrication magazine: www.pcdandf.com
- PCB Standards for design, manufacturing, and testing, the IPC: www.ipc.org
Lead Free Solder and related Tin Whisker problems:
Basic Soldering For Electronics Pace Handbook Of North Usa
·IPC Leadfree Site
·NASA Tin Whisker Basics
·Intel Packaging Databook chapter 2, “Component Surface Mount Technology”, available at www.intel.com/design/packtech/packbook.htm
Basic Soldering For Electronics Pace Handbook Of North Carolina
This page last updated 08 August, 2014